In last months article on HP’s 16 bit processors we mentioned it was made in a reduced version (on an enhanced NMOS III process). This CPU was known as the C5061-3012. It contains only a BPC (Binary Processor Chip) and no EMC or IOC. It was meant for simpler designs, such as a tape controller, but also in some other HP test equipment. While a simpler implementation, it would seem that HP chose to continue the use of rather beautiful, and highly delicate packaging. This example was made in 1984, a time when most other ICs were grey ceramic or plastic, not a white/gold ceramic package.
This was meant to mounted to a heatsink, which dissipated the heat as well as protected the wafer this ceramic (the package, other than where the die is, is less than 1mm thick)