The new product and package position the Pentium processor in the fastest growing segment of the PC marketplace. Worldwide shipments of notebook computers are expected to nearly double, from 5.4 million units in 1993 to 9.9 million units in 1996, according to Dataquest. The 75-MHz processor's immediate availability underscores the extent of the transition from Intel486(TM) processors to Pentium processors into all major segments of computing -- notebooks, desktops and servers.
System vendors who have plans for notebook introductions beginning Q4'94 include leading companies such as Toshiba, NEC Technologies, Acer, Panasonic, Texas Instruments, Zenith Data Systems, Infotel, AMS Inc., Chaplet, and Clevo.
The 3.3 volt 75-MHz Pentium processor is up to twice as fast as the 75-MHz IntelDX4(TM) processor, and is the highest performing processor available that is targeted at the volume notebook market segment. It has an iCOMP(TM) index rating of 610, a SPECint92 rating of 75.2 and a SPECfp92 rating of 60.5. It operates with a 64-bit, 50-MHz external bus.
"The performance gap between desktop and mobile systems disappears with the 75-MHz Pentium processor in notebooks," said Steve Nachtsheim, Intel's vice president of mobile computing. "Users can move confidently from applications on their desktop to their notebook without compromising performance or productivity. The additional processing power will generate new uses by taking advantage of full-motion video, animation, sound, and presentation graphics -- and you can take it all on the road."
Also known as Tape Automated Bonding (TAB) technology, TCP is not new to the semiconductor industry, but its use in packaging microprocessors in notebooks is a first for a volume product. TCP's small size also allows for efficient transfer of heat from the processor die to the system thermal management components. It is expected to be the preferred packaging technology for notebooks, enabling a volume market for systems based on high-performance processors.
The Pentium processor is also available in a conventional staggered pin grid array (SPGA) package. Both TCP and SPGA packages allow vendors to implement notebook designs that effectively manage thermal issues while maintaining high performance.