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NEXGEN SHRINKS Nx586 CHIP WITH HELP FROM IBM
(March 10th 1995) NexGen Microsystems (Milpitas, California) has
announced a foundry agreement with IBM Microelectronics and says its
Nx586 microprocessors will be smaller and offer better
price/performance by mid-year. NexGen says it has reduced the die
size to an edge length of 10.8mm x 10.9mm, making it 40% smaller than
the current Nx586 processor. It says a comparable Pentium from Intel
is almost 40% larger. The smaller die size gives a higher chip per
wafer yield.
The new parts are made in IBM's CMOS 5L 0.5-micron process, and the
circuit layout has also been improved to use all five layers of metal
available from the process. NexGen claims it has 100 Nx586
customers.